Thermally Conductive Fiber Optic Electrically Insulating Epoxy 2156, 2.5gm

Description

Technical Product Bulletin
HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
PRODUCT DESCRIPTION:
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits
and other heat-sensitive
components
to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its
coefficient of thermal expansion provides a good match for the
application.
GENERAL INFORMATION:
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
GENERAL  PROPERTIES:
Appearance
Tan
Cure Type
Heat cure or Room Temperature
Benefit
Fast Cure
Strong
Durable
High- impact bonds at room temperature that improves heat
Mix Ratio by weight
100:23 / Resin:Hardener
Substrates
Bonds readily to itself
Metals
Silica
Steatite,
Alumina,
Sapphire
Other ceramics, glass,
Plastics
Many other materials
Typical Applications
Fiber optic bundles, potting glass fibers and fiber optic connectors
UNCURED PROPERTIES:
Viscosity @ 25 °C
12,000 ±1000 (After Mixing)
@Temperature 77.0 °F, 25°C
Specific Gravity, mixed
2.294
Reactive solids contents, %
100
Pot Life
5 minutes
Shelf life
1 Year
THERMAL PROPERTIES:
Glass transition temperature (Tg),
33°C, 91.4°F
Lap shear strength, psi
3400
(Alum to Alum)
Operating Temperature
-70 to 100 °C
CTE, linear
14.4 µin/in-°F
@Temperature 68.0 °F
CURE SCHEDULE:
1 Hour
@ 25°C
3 Hours
@ 65°C
24 Hours
@ 25°C
MECHANICAL PROPERTIES:
Hardness, Shore D
79
Adhesive Bond Strength
3400
psi
HOW TO USE:
1.
Carefully clean and dry all surfaces to be bonded.
Apply the AA-BOND 2156 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong,
reliable bonds; however,
maintain
contact until adhesive is completely cured.
Some separation of components is common during
shipping and storage. For this reason, it is recommended that the contents of the shipping container be
thoroughly mixed prior to use.
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle
of 52°C for 30 minutes prior to mixing components may
be necessary.
Crystallized epoxy components do not react as well as liquid components and should be
re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in many different packages.
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