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Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat

$ 9.49

Availability: 10499 in stock
  • All returns accepted: ReturnsNotAccepted
  • MPN: EpoxyInternational
  • Country/Region of Manufacture: United States
  • Condition: New
  • Brand: Epoxy International

    Description

    SUPER CONDUCTIVE SILVER EPOXY ADHESIVE - ONE PART
    PRODUCT DESCRIPTION:
    Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat Cure Only is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
    Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat Cure Only shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state.
    Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat Cure Only formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
    Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat Cure Only is designed for use in diversified applications such as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections and circuitry. This epoxy is designed for screening and micro product adhesion applications with the best dispensing capabilities of up to 30 gauge / 0.01"/ 0.255mm.
    PRODUCT PROPERTIES
    Appearance
    Silver
    Cure Type
    Heat Cure
    Benefits
    High strength
    Perfect bond
    EMI & RFI shielding
    Wave guides
    The best dispensing capabilities of up to 30 gauge/0.01"/0.255mm
    Substrates
    Integrated Circuits
    Aluminum
    Copper
    Magnesium
    Steel
    Bronze
    Nickel
    Kovar
    Ceramic
    Glass
    Phenolic
    G-10 epoxy glass boards
    Catalyst
    Anhydride
    Hardness, Shore D
    83
    Typical Application
    microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections and circuitry.
    CURE SCHEDULE
    15 min
    @ 120C, 248 F
    10 min
    @ 150C, 302F
    5 min
    @ 175C, 347F
    UNCURED PROPERTIES
    Viscosity @ 25 C cps
    6,800
    Density gm/cc
    2.35
    Silver , %
    70-72
    Shelf life
    6 Months
    Operating Temperature
    -45C to 170C
    Pot Life @ 25 C
    6 months @ 25C
    PHYSICAL CHARACHTERISTICS
    Sheet Resistivity
    10-12 m/sq
    Adhesion Tensile Strength
    1000 N/cm2 (1500 lb/in2)
    Lap shear Strength
    1400 N/cm2 (2000 lb/in2)
    Thermal Conductivity
    0.04J/(cm.s. C):[0.01cal/(cm.s. C)]
    Specific heat
    0.30J/(g. C) :[0.07 cal/g. C]
    Coefficient of Thermal Expansion
    3x10-5 (m/m)/ C
    Modulus of Elasticity
    4x1010 Pa (6x105lb/in2)
    Poissons Ratio
    0.35
    ELECTRICAL PROPERTIES:
    Volume Resistivity
    < 0.001
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1) Carefully clean and dry all surfaces to be bonded.
    2) Apply Silver-Bond 5 Super Electrically Conductive, Silver Epoxy Adhesive, 1 Part Heat Cure Only completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
    4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
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