-40%

Silver Epoxy Electronic Modules Flat Cable High Frequency Shields, 906, 2.5gm

$ 7.91

Availability: 801 in stock
  • Substrates 1: aluminum, copper, magnesium, steel
  • Keyword: flat cable, wave guides high frequency shields
  • Brand: Atom Adhesives
  • Country/Region of Manufacture: United States
  • Substrates 3: phenolic and G-10 epoxy glass boards.
  • MPN: 906-2
  • Benefits 1: High strength Perfect bond
  • Benefits 2: EMI and RFI shielding Cold Solder
  • Typical Applications 2: circuitry printed circuit board electronics repair
  • Condition: New
  • Model: AA-DUCT 906-2
  • All returns accepted: ReturnsNotAccepted
  • Substrates 2: bronze, nickel, kovar, ceramic, glass
  • Typical Applications 1: Electrical, conductive, rmi efi shielding

    Description

    Technical Product Bulletin
    SILVER EPOXY ELECTRICAL CONDUCTOR
    PRODUCT DESCRIPTION:
    AA-DUCT 906
    represents the newest technology since the introduction of electrically conductive silver compounds. This
    unique formulation is
    based on a silver coated ceramic that results
    in lower material costs without adversely sacrificing
    the properties obtained with a pure silver
    formulation. This concept opens the door to a wide
    range of applications
    previously prohibited
    by the much higher cost of conventional silver
    conductive.
    AA-DUCT 906
    cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar
    and dissimilar substrates
    such as aluminum, copper, magnesium,
    steel, bronze nickel, ceramic, glass, phenolic, and G-10
    epoxy glass boards.
    AA-DUCT 906
    , because of its excellent continuity, has been used extensively in such diversified
    applications as, microwave EMI and RFI
    shielding, in the assembly or repair of printed
    circuit boards, wave guides,
    electronic modules, flat cable, high frequency shields, connections,
    and circuitry and as a cold solder. This unique
    formulation offers ease in handling due to
    its creamy consistency and versatile application by
    hand, automatic dispenser,
    silk-screening, transfer
    or stamping techniques.
    PRODUCT PROPERTIES:
    Appearance
    Silver
    Cure Type
    Heat cure or Room temperature
    Benefits
    High strength
    Perfect bond
    EMI & RFI shielding
    Cold Solder
    Substrates
    Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
    UNCURED PROPERTIES:
    Viscosity
    @ 25 °C cps
    Paste
    Silver coated ceramic
    , %
    50 to 75
    Pot Life
    @ RT
    1 Hour
    Mix ratio, by weight
    100:5 / Resin:Hardener
    Shelf life
    1 Year
    CURE SCHEDULE:
    15 minutes
    @ 100°C
    30 minutes
    @ 60°C
    24 hours
    @ Room temperature
    CURED PROPERTIES:
    Volume Resistivity
    < 0.0015
    Hardness, Shore D
    81
    Compressive Strength, psi
    13,600
    Shrinkage Linear, in / in
    0.004
    Specific Gravity
    , 25°C / 25°C
    2.60
    Tensile Strength
    , psi
    8,900
    Compressive Strength
    , psi
    13,700
    THERMAL PROPERTIES:
    Thermal Conductivity
    , btu / hr / ft2 / °F / in
    90
    Thermal Expansion Coefficient
    , (cm / cm / °C • 10-5)
    1.9
    Heat Distortion
    , °C
    90
    Operating Temperature Range,
    °C
    -50 to +165
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply
    AA-DUCT 906
    completely mixed adhesive to the prepared surfaces, and gently press these surfaces together.
    Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the
    contents of the shipping container be thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle
    warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components
    do not react as well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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