Printed Circuit Boards Silver Epoxy Glue Electrically Conductive 902LP, 2.5gm

Description

Technical Product Bulletin
PURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY LONG POT LIFE EPOXY ADHESIVE
PRODUCT DESCRIPTION:
AA-DUCT 902LP
is an epoxy adhesive and coating formulation based on pure silver.  This versatile silver formulation offers the maximum continuity of conductivity with an
electrical resistivity
value of less than 1x
10-4
ohm-cm.
AA-DUCT 902LP
is also characterized by a wide operating temperature range from –50 to +170°C.
AA-DUCT 902LP
is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
PRODUCT PROPERTIES:
Appearance
Silver
Cure Type
Heat cure or Room temperature
Benefits
High strength
Perfect bond
Cold solder for heat sensitive components
Mix Ratio by weight
100:6 / Resin:Hardener
Substrates
Aluminum
Copper
Magnesium
Steel
Bronze
Nickel
Kovar
Ceramic
Glass
Phenolic
G-10 epoxy glass boards.
Typical Applications
Electrical
Conductive
Rmi/efi shielding
Circuitry
Printed circuit board
Electronics repair
UNCURED PROPERTIES:
Viscosity @ 25 °C  cps
Paste
Specific Gravity, mixed
2.79
Reactive solids contents, %
100
Pot Life
3 hours
Shelf life
1 Year
CURE SCHEDULE:
2 minutes
@ 120°C
5 minutes
@ 100°C
24 hours
@ 25°C
CURED PROPERTIES:
Hardness, Shore D
85
Shrinkage linear   in/in
0.003
Tensile Strength, psi
9500
Volume Resistivity ohm. cm
<0.0001
Compressive Strength, psi
14,000
Lap Shear Strength,  PSI
9400
THERMAL PROPERTIES:
Thermal Conductivity, btu / hr / ft2 / °F / in
100
Thermal Expansion Coefficient
(cm / cm / °C · 10-5)
1.5
Heat Distortion, °C:
95
Operating Temperature Range, °C:
-50 to +170
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1)
Carefully clean and dry all surfaces to be bonded.
2)
Apply
AA-DUCT 902LP
completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong,
reliable bonds; however, maintain contact until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly
mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to
mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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