-40%

Fiber Optic Assembly Multimode & Single Mode Connectors Epoxy Kit F112, 2.5 gm

$ 5.27

Availability: 804 in stock
  • Typical Applications 1: Fiber optic assembly
  • All returns accepted: ReturnsNotAccepted
  • Country/Region of Manufacture: United States
  • Typical Applications 2: multimode and single mode connectors
  • Typical Applications 3: small potting and sealing applications
  • Condition: New
  • Benefits 1: Low viscosity Thermal shock
  • Brand: Atom Adhesives
  • Model: AA-BOND F112-10
  • Benefits 2: impact resistant Low stress connections
  • MPN: F112-10

    Description

    Technical Product Bulletin
    FIBER OPTIC ASSEMBLY EPOXY ADHESIVE
    PRODUCT DESCRIPTION:
    AA-BOND F112 is an impact resistant, fiber-optic adhesive.
    AA-BOND F112 is two-part, low viscosity epoxy has the distinct
    advantage of remaining below 3000 cps for a minimum of 40
    minutes.
    AA-BOND F112 allows more connectors to be produced from one mix. Low stress, AA-BOND F112 is an excellent choice for
    multimode connectors and single mode connectors
    where excessive
    curing
    temperatures may cause cracking.
    AA-BOND F112 can be cured at room temperature overnight or as fast as 15 minutes at 90°C. The blue color facilitates easy
    polishing and its cured properties prevent pistoning.
    This product is a
    100%
    solid system that can be used for small potting
    and sealing applications where resistance to thermal
    shock and impact are required.
    THERMAL PROPERTIES:
    CTE, linear
    34.4 µin/in-°F
    Glass Transition Temp, Tg
    216 °F
    Operating Temperature
    -60 to 100 °C
    PRODUCT CHARACTERISTICS:
    Appearance
    Dark Blue
    Components
    2 component -
    requires mixing
    Mix Ratio, by weight
    100/30 Resin:Hardener
    Benefits
    ·
    Low viscosity
    ·
    Thermal shock and impact resistant
    ·
    Low stress connections
    Cure Type
    Room Temperature or Heat Cure
    Typical Applications
    ·
    Fiber optic assembly
    ·
    Multimode and single mode connectors
    ·
    Small potting
    ·
    Sealing applications
    CURE SCHEDULE:
    24 hours
    @ 25°C
    1 hour
    @ 65°C
    15 minutes
    @ 90°C
    CURED PROPERTIES:
    Glass Transition Temperature
    (Tg), ultimate, °C
    102
    Refractive Index
    1.51
    Water Absorption %
    0.07
    UNCURED PROPERTIES:
    Viscosity @ 25 °C, cps
    1800
    @ 25 °C, 77 °F
    Thixotropic Index
    1.0
    Specific Gravity, cured
    1.2
    Pot Life
    30 minutes
    MECHANICAL PROPERTIES:
    Hardness, Shore D
    85
    Adhesive Bond Strength
    (Lap shear, alum to alum)
    2500 psi
    24 hrs @ 25°C
    3000
    psi
    1 hr @ 65°C
    4300 psi
    15 min @ 90°C
    GENERAL INFORMATION:
    For safe handling information on this product, consult the
    Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1- Carefully clean and dry all surfaces to be bonded.
    2- Apply this completely mixed adhesive to the prepared
    surfaces, and gently press these surfaces together.
    Contact pressure is adequate for strong, reliable bonds;
    however,
    maintain contact until adhesive is completely
    cured.
    3- Some separation of components is common during
    shipping and storage. For this reason, it is recommended
    that the contents of the shipping container be
    thoroughly
    mixed
    prior to use.
    4- Some ingredients in this formulation provided may crystallize when subjected to low temperature
    storage. A gentle warming cycle of 52°C for 30 minutes prior to
    mixing
    components may be
    necessary. Crystallized epoxy components do not react as well as liquid components and should be
    re-dissolved prior to use for best results.
    AVAILABILITY:.
    This epoxy can be supplied in many different packages.
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